OXYGEN SMD has been in the SMT manufacturing business since 2013. Ever since then our production has been developing to match our customers’ needs. We can tackle quite different tasks on our two manufacturing lines, from basic LED panels to more complex circuits. We manufacture RF based, High component density cards daily which makes our team highly knowledgeable in all parts of the procedure.
The manufacturing process starts with preparing the files from the customer. We use the supplied GERBER, Pick & place, and BoM files to create a program for our machines. Using the paste layer from the Gerber we manufacture a printing stencil for the application of the solder paste. Our company can help with the supply of components, so we can use the best ones for our customers.
The created manufacturing program is optimized, which gives us a component list. This list is used to specify which component is placed in what kind of the dispenser on which machine for manufacture. We able to work with all kinds of packing, let it be reel, tube or tray.
Manufacturing starts with loading the PCBs into our dispensing units. These devices feed them one by one to our solder paste printing machine. The printer uses a stencil to dispense the soldering paste onto the circuit. The stencil defines the dispensed solder shape, thickness, and position. For this reason, we check the stencil for every product before the beginning of manufacture. The stencil is lined up using fiducials positioning on the cards. When that is successful the card is raised, the squeegee moves across the stencil, printing the solder needed to the card. At the end, the card is lowered down, the stencil and squeegee get cleaned and the printed PCB gets inspected at the solder paste inspection machine. If everything passes the test it is handed over to the pick & place machines.
The machines pick up components from feeders loaded by operators, using a vacuum. The system measures every placed component to check for orientation and then its placed on the PCB. This happens 120.000 times a day on every line! After placement is complete, another automated test checks optically if everything is fine. When a circuit passes this phase, it is ready for soldering.
The soldering phase happens in our reflow furnace where the solder paste melts and connects the components to the PCB. This way we can reproduce the same quality soldering work on every card. The furnace is calibrated with a thermal profiling tool on every new circuit. The finished cards go through a final inspection. If the card were SMT only then it would get packaged and shipped out, if it needs THT soldering we will add that by hand before shipping the complete product.
On our manufacturing lines we work with the out most discipline, expertise, and support from internal engineering team. Any kind of production request received by us, we treat it as our own. We put a big emphasis on product pre-production verification, usually communicating directly with the customers engineering team.
